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CLC number: TG301
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Received: 2005-12-16
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Simulation study on fluctuant flow stress scale effect
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SHEN Yu, YU Hu-ping, RUAN Xue-yu. Simulation study on fluctuant flow stress scale effect[J]. Journal of Zhejiang University Science A, 2006, 7(8): 1343-1350.
@article{title="Simulation study on fluctuant flow stress scale effect",
author="SHEN Yu, YU Hu-ping, RUAN Xue-yu",
journal="Journal of Zhejiang University Science A",
volume="7",
number="8",
pages="1343-1350",
year="2006",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.2006.A1343"
}
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%A RUAN Xue-yu
%J Journal of Zhejiang University SCIENCE A
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%D 2006
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.2006.A1343
TY - JOUR
T1 - Simulation study on fluctuant flow stress scale effect
A1 - SHEN Yu
A1 - YU Hu-ping
A1 - RUAN Xue-yu
J0 - Journal of Zhejiang University Science A
VL - 7
IS - 8
SP - 1343
EP - 1350
%@ 1673-565X
Y1 - 2006
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.2006.A1343
Abstract: Crystal plasticity theory was used to simulate upsetting tests of different dimensions and grain size micro copper cylinders in this study on the fluctuant flow stress scale effect. Results showed that with the decrease of billet grain quantity, flow stress fluctuation is not always increased, but there is a maximum. Through this study, the fluctuant flow stress scale effect can be understood deeper, and relevant necessary information was obtained for further prediction and control of this scale effect and to design the microforming process and die.
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