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Journal of Zhejiang University SCIENCE A 2008 Vol.9 No.6 P.849~857

http://doi.org/10.1631/jzus.A071489


In-package P/G planes analysis and optimization based on transmission matrix method


Author(s):  Yin-jun WANG, Cheng ZHUO, Jun-yong DENG, Jin-fang ZHOU, Kang-sheng CHEN

Affiliation(s):  Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China

Corresponding email(s):   vividbubu@hotmail.com, Zhoujf@zju.edu.cn

Key Words:  Decoupling capacitor, Power/ground (P/G) planes, Simultaneous switching noise (SSN), Transmission matrix method (TMM), Irregular partition, Power integrity (PI)


Yin-jun WANG, Cheng ZHUO, Jun-yong DENG, Jin-fang ZHOU, Kang-sheng CHEN. In-package P/G planes analysis and optimization based on transmission matrix method[J]. Journal of Zhejiang University Science A, 2008, 9(6): 849~857.

@article{title="In-package P/G planes analysis and optimization based on transmission matrix method",
author="Yin-jun WANG, Cheng ZHUO, Jun-yong DENG, Jin-fang ZHOU, Kang-sheng CHEN",
journal="Journal of Zhejiang University Science A",
volume="9",
number="6",
pages="849~857",
year="2008",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.A071489"
}

%0 Journal Article
%T In-package P/G planes analysis and optimization based on transmission matrix method
%A Yin-jun WANG
%A Cheng ZHUO
%A Jun-yong DENG
%A Jin-fang ZHOU
%A Kang-sheng CHEN
%J Journal of Zhejiang University SCIENCE A
%V 9
%N 6
%P 849~857
%@ 1673-565X
%D 2008
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.A071489

TY - JOUR
T1 - In-package P/G planes analysis and optimization based on transmission matrix method
A1 - Yin-jun WANG
A1 - Cheng ZHUO
A1 - Jun-yong DENG
A1 - Jin-fang ZHOU
A1 - Kang-sheng CHEN
J0 - Journal of Zhejiang University Science A
VL - 9
IS - 6
SP - 849
EP - 857
%@ 1673-565X
Y1 - 2008
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.A071489


Abstract: 
power integrity (PI) has become a limiting factor for the chip’s overall performance, and how to place in-package decoupling capacitors to improve a chip’s PI performance has become a hot issue. In this paper, we propose an improved transmission matrix method (TMM) for fast decoupling capacitance allocation. An irregular grid partition mechanism is proposed, which helps speed up the impedance computation and complies better with the irregular power/ground (P/G) plane or planes with many vias and decoupling capacitors. Furthermore, we also ameliorate the computation procedure of the impedance matrix whenever decoupling capacitors are inserted or removed at specific ports. With the fast computation of impedance change, in-package decoupling capacitor allocation is done with an efficient change based method in the frequency domain. Experimental results show that our approach can gain about 5× speedup compared with a general TMM, and is efficient in restraining the noise on the P/G plane.

Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article

Reference

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[6] Lee, J., Dragos, M.H., Iyer, M.K., Kim, H., Kim, J., 2005. Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs. Adv. Pack., 28(2):298-309.

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[8] Li, S.Q., Yu, Y.X., Chan, C.F., Chan, K.F., Tsang, L., 2001. A sparse-matrix/canonical grid method for analyzing densely packed interconnects. IEEE Trans. on Microwave Theory Tech., 49(7):1221-1228.

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[10] Na, N.J., Budell, T., Chiu, C., Tremble, E., Wemple, I., 2004. The Effects of On-chip and Package Decoupling Capacitors and an Efficient ASIC Decoupling Methodology. Electronic Components and Technology Conf., p.556-567.

[11] Phillips, J.R., White, J.K., 1997. A precorrected-FFT method for electrostatic analysis of complicated 3-D structures. IEEE Trans. on Computer-Aided Design Integr. Circuits Syst., 16(10):1059-1072.

[12] Wang, C., Mao, J.K., Selli, C., Luan, S.F., Zhang, L., Fan, J., Pommerenke, D.J., DuBroff, R.E., Drewniak, J.L., 2006. An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances. IEEE Trans. on Adv. Pack., 29(2):320-334.

[13] Wang, H.G., Chan, C.H., Tsang, L., 2004. A New Multilevel Green’s Function Interpolation Method for Large Scale EM Simulations in RF ICs. IEEE Antennas and Propagation Society Int. Symp., p.1182-1186.

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[15] Zheng, H., Krauter, B., Pileggi, L., 2003. On-Package Decoupling Optimization with Package Macromodels. Proc. IEEE Custom Integrated Circuits Conf., p.723-726.

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