| index | Title |
| 1 | Low temperature Si/Si wafer direct bonding using a plasma activated method Author(s):Dong-ling Li, Zheng-guo Shang, She... Clicked:10539 Download:11748 Cited:5 <Full Text> Journal of Zhejiang University Science C 2013 Vol.14 No.4 P.244-251 DOI:10.1631/jzus.C12MNT02 |
| 2 | 3D analysis for pit evolution and pit-to-crack transition during corrosion fatigue Author(s):Xiao-guang Huang, Jin-quan Xu Clicked:10866 Download:5338 Cited:3 <Full Text> <PPT> 2734 Journal of Zhejiang University Science A 2013 Vol.14 No.4 P.292-299 DOI:10.1631/jzus.A1200273 |
| 3 | Relation between drying shrinkage behavior and the microstructure of metakaolin-based geopolymer Author(s):Shi-kun Chen, Cheng-lin Wu, Dong-m... Clicked:6998 Download:5354 Cited:0 <Full Text> <PPT> 2486 Journal of Zhejiang University Science A 2021 Vol.22 No.10 P.819-834 DOI:10.1631/jzus.A2000513 |