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CLC number: TN305.7

On-line Access: 2013-04-03

Received: 2012-10-08

Revision Accepted: 2013-01-14

Crosschecked: 2013-03-13

Cited: 5

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Citations:  Bibtex RefMan EndNote GB/T7714

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Journal of Zhejiang University SCIENCE C 2013 Vol.14 No.4 P.244-251


Low temperature Si/Si wafer direct bonding using a plasma activated method

Author(s):  Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen

Affiliation(s):  National Key Laboratory of Fundamental Science of Novel Micro/Nano Device and System Technology, Chongqing University, Chongqing 400044, China; more

Corresponding email(s):   lidongling@cqu.edu.cn

Key Words:  Low temperature, Wafer direct bonding, O2 plasma activation, Surface energy, Void formation

Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen. Low temperature Si/Si wafer direct bonding using a plasma activated method[J]. Journal of Zhejiang University Science C, 2013, 14(4): 244-251.

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author="Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen",
journal="Journal of Zhejiang University Science C",
publisher="Zhejiang University Press & Springer",

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%T Low temperature Si/Si wafer direct bonding using a plasma activated method
%A Dong-ling Li
%A Zheng-guo Shang
%A Sheng-qiang Wang
%A Zhi-yu Wen
%J Journal of Zhejiang University SCIENCE C
%V 14
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%D 2013
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.C12MNT02

T1 - Low temperature Si/Si wafer direct bonding using a plasma activated method
A1 - Dong-ling Li
A1 - Zheng-guo Shang
A1 - Sheng-qiang Wang
A1 - Zhi-yu Wen
J0 - Journal of Zhejiang University Science C
VL - 14
IS - 4
SP - 244
EP - 251
%@ 1869-1951
Y1 - 2013
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.C12MNT02

Manufacturing and integration of micro-electro-mechanical systems (MEMS) devices and integrated circuits (ICs) by wafer bonding often generate problems caused by thermal properties of materials. This paper presents a low temperature wafer direct bonding process assisted by O2 plasma. Silicon wafers were treated with wet chemical cleaning and subsequently activated by O2 plasma in the etch element of a sputtering system. Then, two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours. An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy. The bonding yield reaches 90%–95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 °C in N2 atmosphere for 2 h. void formation was systematically observed and elimination methods were proposed. The size and density of voids greatly depend on the annealing temperature. Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy. A pulling test reveals that the bonding strength is more than 11.0 MPa. This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration, system on chip, and MEMS packaging.

Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article


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