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CLC number: TB114.3; O224; O211.6

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Received: 2006-12-19

Revision Accepted: 2007-01-05

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Journal of Zhejiang University SCIENCE A 2007 Vol.8 No.3 P.397~402

10.1631/jzus.2007.A0397


Finite element model analysis of thermal failure in connector


Author(s):  WANG Xin, XU Liang-jun

Affiliation(s):  Research Lab of Electric Contacts, Beijing University of Posts & Telecommunications, Beijing 100876, China

Corresponding email(s):   wangxin820117@gmail.com

Key Words:  Connector, Stress relaxation, Finite element method (FEM), Thermal failure


WANG Xin, XU Liang-jun. Finite element model analysis of thermal failure in connector[J]. Journal of Zhejiang University Science A, 2007, 8(3): 397~402.

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author="WANG Xin, XU Liang-jun",
journal="Journal of Zhejiang University Science A",
volume="8",
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pages="397~402",
year="2007",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.2007.A0397"
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%DOI 10.1631/jzus.2007.A0397

TY - JOUR
T1 - Finite element model analysis of thermal failure in connector
A1 - WANG Xin
A1 - XU Liang-jun
J0 - Journal of Zhejiang University Science A
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EP - 402
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Y1 - 2007
PB - Zhejiang University Press & Springer
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DOI - 10.1631/jzus.2007.A0397


Abstract: 
Thermal analysis and thermal diagnose are important for small power connector especially in electronic devices since their structure is usually compact. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and that increased contact resistance produced more Joule heating; this mutual action causes the connector to lose efficiency. The thermal distribution in the connector was analyzed using finite element method (FEM). The failure mechanism is discussed. It provides basis for improving the structure. The conclusion was verified by experimental results.

Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article

Reference

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[6] Oberg, A., Olssen, K.E., 1996. Computer Simulation of the Influence of Intermetallics on the Stability of Electrical Contacts. Proc. 42th IEEE Holm Conf., p.137.

[7] Robert, D.M., 1988. Multispot Model of Contacts Based on Surface Features. The 34th Holm Conference on Electrical Contact, p.256.

[8] Schedin, E., Thuvander, A., Henderson, P., Sandberg, P., Kamf, A., 1996. Stress Relaxation Behaviour of Connectors—Development of Simulation Techniques. Proc. 42th IEEE Holm Conf., p.142.

[9] Singer, M.T., 1991. Electrical resistance of random rough contacting surfaces using fractal surface modeling the contact interface. IEEE Trans. on CHMT, 14(1):89-93.

[10] Willamison, B.J.P., 1981. The Microworld of the Contact Spot, The 27th Holm Conference on Electrical Contact, p.245.

[11] Yu, H.Y., Li, J.C., 1977. Computer simulation of impression creep by the finite element method. Journal of Materials Science, 12(11):2214-2222.

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