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CLC number: TB114.3; O224; O211.6
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Received: 2006-12-19
Revision Accepted: 2007-01-05
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Finite element model analysis of thermal failure in connector
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WANG Xin, XU Liang-jun. Finite element model analysis of thermal failure in connector[J]. Journal of Zhejiang University Science A, 2007, 8(3): 397-402.
@article{title="Finite element model analysis of thermal failure in connector",
author="WANG Xin, XU Liang-jun",
journal="Journal of Zhejiang University Science A",
volume="8",
number="3",
pages="397-402",
year="2007",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.2007.A0397"
}
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%T Finite element model analysis of thermal failure in connector
%A WANG Xin
%A XU Liang-jun
%J Journal of Zhejiang University SCIENCE A
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%@ 1673-565X
%D 2007
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.2007.A0397
TY - JOUR
T1 - Finite element model analysis of thermal failure in connector
A1 - WANG Xin
A1 - XU Liang-jun
J0 - Journal of Zhejiang University Science A
VL - 8
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SP - 397
EP - 402
%@ 1673-565X
Y1 - 2007
PB - Zhejiang University Press & Springer
ER -
DOI - 10.1631/jzus.2007.A0397
Abstract: Thermal analysis and thermal diagnose are important for small power connector especially in electronic devices since their structure is usually compact. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and that increased contact resistance produced more Joule heating; this mutual action causes the connector to lose efficiency. The thermal distribution in the connector was analyzed using finite element method (FEM). The failure mechanism is discussed. It provides basis for improving the structure. The conclusion was verified by experimental results.
[1] Greenwood, A., 1966. Contact of Nominally Flat Surface, Proceeding of the Royal Society, p.295.
[2] Internal Reports, 2006. Research Report of Failure Analysis on the Burned Connectors.
[3] Li, K., Lu, J.G., Zhang, G.S., 1997. Mathematical analysis of thermal process of static electrical contacts. High Voltage Apparatus, 1:134.
[4] Li, K., Su, X.P., Li, Z.G., Lu, J.G., Zhang, G.S., 1998. The Finite-Element Model and Analysis of Static Contact Resistance and Thermal Process for Contact with Film. Proc. 44th IEEE Holm Conf., p.226-229.
[5] Morita, T., Ohuchi, K., Kaji, M., 1996. Numerical Model of Crimping by Finite Element Method. Proc. 42th IEEE Holm Conf., p.151-155.
[6] Oberg, A., Olssen, K.E., 1996. Computer Simulation of the Influence of Intermetallics on the Stability of Electrical Contacts. Proc. 42th IEEE Holm Conf., p.137.
[7] Robert, D.M., 1988. Multispot Model of Contacts Based on Surface Features. The 34th Holm Conference on Electrical Contact, p.256.
[8] Schedin, E., Thuvander, A., Henderson, P., Sandberg, P., Kamf, A., 1996. Stress Relaxation Behaviour of Connectors—Development of Simulation Techniques. Proc. 42th IEEE Holm Conf., p.142.
[9] Singer, M.T., 1991. Electrical resistance of random rough contacting surfaces using fractal surface modeling the contact interface. IEEE Trans. on CHMT, 14(1):89-93.
[10] Willamison, B.J.P., 1981. The Microworld of the Contact Spot, The 27th Holm Conference on Electrical Contact, p.245.
[11] Yu, H.Y., Li, J.C., 1977. Computer simulation of impression creep by the finite element method. Journal of Materials Science, 12(11):2214-2222.
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