JZUS - Journal of Zhejiang University SCIENCE

Frontiers of Information Technology & Electronic Engineering 2020 Vol.21 No.1 P.174-181

http://doi.org/10.1631/FITEE.1900453

Integrated 60-GHz miniaturized wideband metasurface antenna in a GIPD process

Author(s): Hai-yang Xia, Jin-can Hu, Tao Zhang, Lian-ming Li, Fu-chun Zheng
Affiliation(s): National Mobile Communications Research Laboratory, Department of Radio Engineering, School of Information Science and Engineering, Southeast University, Nanjing 210096, China; more
Corresponding email(s): Lianming.LI@seu.edu.cn, fzheng@ieee.org
Key Words: 60 GHz, Antenna-in-package (AiP), Coplanar-waveguide-fed (CPW-fed) ring resonators, Glass integrated passive device (GIPD), Metasurface antenna, Miniaturized antenna

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Abstract: We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications. With the glass integrated passive device manufacturing technology, we introduce a coplanar-waveguide-fed (CPW-fed) ring resonator to characterize the material properties of the glass substrate. The proposed antenna is designed on a high dielectric constant glass substrate to achieve antenna miniaturization. Because of the existence of gaps between patch units compared with the conventional rectangular patch in the TM₁₀ mode, the radiation aperture of this proposed antenna is reduced. Located right above the center feeding CPW-fed bow-tie slot, the metasurface patch is realized, supporting the TM₁₀ mode and antiphase TM₂₀ mode simultaneously to improve the bandwidth performance. Using a probe-based antenna measurement setup, the antenna prototype is measured, demonstrating a 10-dB impedance bandwidth from 53.3 to 67 GHz. At 60 GHz, the antenna gain measured is about 5 dBi in the boresight direction with a compact radiation aperture of 0.31λ₀×0.31λ₀ and a thickness of 0.06λ₀.

基于玻璃集成无源器件工艺的60-GHz小型化宽带超表面天线

夏海洋^1,2，胡金灿^1,2，张涛^2,3，李连鸣^1,2，郑福春^1,2
¹东南大学信息科学与工程学院移动通信国家重点实验室，中国南京市，210096
²紫金山实验室，中国南京市，211111
³西安电子科技大学微电子学院，中国西安市，710071

摘要：提出一种面向封装天线应用的60-GHz小型化宽带超表面天线。基于玻璃集成无源器件制造技术，采用共面波导馈电环形谐振器表征玻璃基板的材料特性。该天线于高介电常数玻璃基板上设计以实现天线小型化。在TM10模式下，贴片单元之间的间隙使该天线贴片辐射孔径得以减小。该天线在结构上采用共面波导馈电，进而激励蝶形缝隙，最终耦合激励位于天线上表面的超表面贴片。该天线可同时支持TM10模和反相TM20模，从而提升带宽性能。经过设计、优化及加工，该天线的辐射贴片尺寸为0.31λ₀×0.31λ₀，厚度为0.06λ₀。采用基于探针结构的天线测量装置完成该天线测试，测试结果显示天线带宽为53.3—67GHz。在60 GHz频点处，该天线增益测量值约为5 dBi。

关键词：60 GHz；封装天线；共面波导馈电环形谐振器；玻璃集成无源器件；超表面天线；小型化天线

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