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CLC number: TN82

On-line Access: 2016-01-05

Received: 2015-05-20

Revision Accepted: 2015-07-09

Crosschecked: 2015-12-08

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Citations:  Bibtex RefMan EndNote GB/T7714


Gang Dong


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Frontiers of Information Technology & Electronic Engineering  2016 Vol.17 No.1 P.67-73


Antenna-in-package system integrated with meander line antenna based on LTCC technology

Author(s):  Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang

Affiliation(s):  School of Microelectronics, Xidian University, Xi’an 710071, China

Corresponding email(s):   gdong@mail.xidian.edu.cn

Key Words:  Antenna-in-package (AiP), Meander line antenna, Multi-chip module (MCM), Low temperature co-fired ceramic (LTCC)

Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang. Antenna-in-package system integrated with meander line antenna based on LTCC technology[J]. Frontiers of Information Technology & Electronic Engineering, 2016, 17(1): 67-73.

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author="Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang",
journal="Frontiers of Information Technology & Electronic Engineering",
publisher="Zhejiang University Press & Springer",

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%T Antenna-in-package system integrated with meander line antenna based on LTCC technology
%A Gang Dong
%A Wei Xiong
%A Zhao-yao Wu
%A Yin-tang Yang
%J Frontiers of Information Technology & Electronic Engineering
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%I Zhejiang University Press & Springer
%DOI 10.1631/FITEE.1500167

T1 - Antenna-in-package system integrated with meander line antenna based on LTCC technology
A1 - Gang Dong
A1 - Wei Xiong
A1 - Zhao-yao Wu
A1 - Yin-tang Yang
J0 - Frontiers of Information Technology & Electronic Engineering
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PB - Zhejiang University Press & Springer
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DOI - 10.1631/FITEE.1500167

We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.

The manuscript developed AiP using LTCC technology. There are many interesting observations.


目的:基于LTCC工艺,设计工作于2.4 GHz频段范围且满足性能指标要求的集成封装天线,同时设计封装腔体结构实现电路芯片的集成。
结论:针对2.4 GHz频段的应用需要,提出了一种小型化高集成度的封装天线结构。该结构满足实际应用所需的性能指标,且能方便地通过LTCC工艺实现。


Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article


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