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CLC number: TN82

On-line Access: 2016-01-05

Received: 2015-05-20

Revision Accepted: 2015-07-09

Crosschecked: 2015-12-08

Cited: 0

Clicked: 6209

Citations:  Bibtex RefMan EndNote GB/T7714

 ORCID:

Gang Dong

http://orcid.org/0000-0001-6557-2286

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Frontiers of Information Technology & Electronic Engineering  2016 Vol.17 No.1 P.67-73

http://doi.org/10.1631/FITEE.1500167


Antenna-in-package system integrated with meander line antenna based on LTCC technology


Author(s):  Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang

Affiliation(s):  School of Microelectronics, Xidian University, Xian 710071, China

Corresponding email(s):   gdong@mail.xidian.edu.cn

Key Words:  Antenna-in-package (AiP), Meander line antenna, Multi-chip module (MCM), Low temperature co-fired ceramic (LTCC)


Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang. Antenna-in-package system integrated with meander line antenna based on LTCC technology[J]. Frontiers of Information Technology & Electronic Engineering, 2016, 17(1): 67-73.

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Abstract: 
We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.

The manuscript developed AiP using LTCC technology. There are many interesting observations.

基于LTCC技术集成曲折线天线的封装天线系统

目的:基于LTCC工艺,设计工作于2.4 GHz频段范围且满足性能指标要求的集成封装天线,同时设计封装腔体结构实现电路芯片的集成。
创新点:设计了一种曲折线天线结构用以实现系统的小型化。在封装层腔体内引入一种叠层多芯片组件结构,提高了整体集成度。通过添加通孔及馈线结构减少天线与封装层内部芯片间的电磁耦合。
方法:首先,基于LTCC的材料特性及设计的性能需要,设计一种曲折线形天线,并对其原理进行分析,对其回波损耗特性进行仿真(图3)。然后,针对封装天线集成电路芯片的需要,提出一种LTCC材料的多芯片组件结构(图8),同时在封装层内加入一定数量的金属通孔(图9),以减少天线与芯片间的电磁耦合。最后,将上述设计的天线与封装层结构整合在一起,并进行实际制作(图12),通过测试得到制作的封装天线系统的方向特性图(图13)和回波损耗特性曲线(图14)。
结论:针对2.4 GHz频段的应用需要,提出了一种小型化高集成度的封装天线结构。该结构满足实际应用所需的性能指标,且能方便地通过LTCC工艺实现。

关键词:封装天线;曲折线天线;多芯片组件;低温共烧陶瓷

Darkslateblue:Affiliate; Royal Blue:Author; Turquoise:Article

Reference

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