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On-line Access: 2024-04-16

Received: 2022-12-21

Revision Accepted: 2023-06-13

Crosschecked: 2024-04-16

Cited: 0

Clicked: 432

Citations:  Bibtex RefMan EndNote GB/T7714

 ORCID:

Yanqin LI

https://orcid.org/0000-0002-4335-834X

Bo ZHAO

https://orcid.org/0000-0003-0096-9324

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Journal of Zhejiang University SCIENCE A 2024 Vol.25 No.4 P.311-323

http://doi.org/10.1631/jzus.A2200609


Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings


Author(s):  Yanqin LI, Daohui XIANG, Guofu GAO, Feng JIAO, Bo ZHAO

Affiliation(s):  School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China

Corresponding email(s):   zhaob@hpu.edu.cn

Key Words:  Ultrasonic vibration grinding, Undeformed chip thickness (UCT), Distribution characteristics, Surface roughness


Yanqin LI, Daohui XIANG, Guofu GAO, Feng JIAO, Bo ZHAO. Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings[J]. Journal of Zhejiang University Science A, 2024, 25(4): 311-323.

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author="Yanqin LI, Daohui XIANG, Guofu GAO, Feng JIAO, Bo ZHAO",
journal="Journal of Zhejiang University Science A",
volume="25",
number="4",
pages="311-323",
year="2024",
publisher="Zhejiang University Press & Springer",
doi="10.1631/jzus.A2200609"
}

%0 Journal Article
%T Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings
%A Yanqin LI
%A Daohui XIANG
%A Guofu GAO
%A Feng JIAO
%A Bo ZHAO
%J Journal of Zhejiang University SCIENCE A
%V 25
%N 4
%P 311-323
%@ 1673-565X
%D 2024
%I Zhejiang University Press & Springer
%DOI 10.1631/jzus.A2200609

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T1 - Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings
A1 - Yanqin LI
A1 - Daohui XIANG
A1 - Guofu GAO
A1 - Feng JIAO
A1 - Bo ZHAO
J0 - Journal of Zhejiang University Science A
VL - 25
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SP - 311
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PB - Zhejiang University Press & Springer
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DOI - 10.1631/jzus.A2200609


Abstract: 
ultrasonic vibration grinding differs from traditional grinding in terms of its material removal mechanism. The randomness of grain–workpiece interaction in ultrasonic vibration grinding can produce variable chips and impact the surface roughness of workpiece. However, previous studies used iterative method to calculate the unformed chip thickness (UCT), which has low computational efficiency. In this study, a symbolic difference method is proposed to calculate the UCT. The UCT distributions are obtained to describe the stochastic interaction characteristics of ultrasonic grinding process. Meanwhile, the UCT distribution characteristics under different machining parameters are analyzed. Then, a surface roughness prediction model is established based on the UCT distribution. Finally, the correctness of the model is verified by experiments. This study provides a quick and accurate method for predicting surface roughness in longitudinal ultrasonic vibration grinding.

轴承内孔超声振动磨削未变形切屑厚度分布及表面粗糙度预测

作者:李艳琴,向道辉,高国富,焦锋,赵波
机构:河南理工大学,机械与动力工程学院,中国焦作,454000
目的:超声振动辅助磨削在材料去除机理上与传统磨削有明显不同。超声振动辅助磨削中颗粒与工件相互作用的随机性会产生不同形状与厚度的切屑,然而,对超声磨削过程中的磨粒-工件相互作用的随机性及与表面粗糙度的关系还有待进一步研究。
创新点:提供一种快速有效的方法预测纵向超声振动磨削加工工件的表面粗糙度。
方法:1.采用符号差分法(表1)计算磨粒与工件的干涉深度和宽度,得到未变形切屑厚度(UCT)分布来描述磨粒与工件相互作用的随机特性。2.分析不同磨削参数下UCT厚度分布的特征。3.基于UCT分布,建立表面粗糙度预测模型。4.通过实验验证模型的有效性。
结论:1.基于超声磨削过程中磨粒的运动轨迹,提出符号差分法计算磨粒与工件的干涉深度和宽度,提高仿真效率。2.在超声磨削过程中UCT分布服从指数分布;通过提取不同加工参数下UCT分布的特征参数,发现超声波的应用可以改变UCT的深度和宽度,增强重复干涉效应,以及降低表面粗糙度。3.分析磨削参数对UCT分布特性的影响规律发现,基于UCT均值建立表面粗糙度预测模型得到的实验值与理论值的变化趋势一致,且最大偏差为14.3%。4.高砂轮转速、低工件速度、小磨削深度及合适的超声振幅有利于获得较低的UCT,从而形成较光滑的工件表面。

关键词:超声振动磨削;未变形切屑厚度(UCT);分布特征;表面粗糙度

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